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    Part Img PMBD914,215 datasheet by NXP Semiconductors

    • Single high-speed switching diode - C<sub>d</sub> max.: 1.5 pF; Configuration: single ; I<sub>F</sub> max: 215 mA; I<sub>FSM</sub> max: 4 A; I<sub>R</sub> max: 1000@VR=75V nA; IFRM: 500 mA; t<sub>rr</sub> max: 4 ns; V<sub>F</sub>max: 1@IF=50mA mV; V<sub>R</sub> max: 100 V; Package: SOT23 (TO-236AB); Container: Tape reel smd
    • Original
    • Yes
    • Transferred
    • EAR99
    • 8541.10.00.70
    • 8541.10.00.70
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    PMBD914,215 datasheet preview

    PMBD914,215 Frequently Asked Questions (FAQs)

    • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
    • Ensure good thermal conductivity by using a heat sink or thermal pad, and avoid blocking airflow around the device. Monitor the junction temperature (Tj) and adjust the operating conditions accordingly.
    • Choose suitable input and output capacitors, inductors, and resistors that meet the recommended specifications. Ensure the components can handle the maximum current and voltage ratings.
    • Use an oscilloscope to monitor the output voltage and current. Check for proper PCB layout, component selection, and thermal management. Consult the datasheet and application notes for troubleshooting guidelines.
    • Yes, but ensure you follow the recommended design and testing guidelines for high-reliability applications. Consult the datasheet and relevant industry standards (e.g., IEC 61508) for safety-critical applications.
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