NXP recommends a thermal pad on the bottom of the device, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power handling capabilities at higher temperatures.
Although the datasheet specifies a maximum input voltage of 30V, it's recommended to limit the input voltage to 25V to ensure reliable operation and prevent damage to the device.
To protect the device from ESD, follow proper handling and storage procedures, use ESD-safe materials, and consider adding ESD protection devices, such as TVS diodes, to the PCB design.
NXP recommends a soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 3-5 minutes. It's essential to follow the recommended soldering profile to prevent damage to the device.
PMGD175XN,115 datasheet
by NXP Semiconductors
