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    PMLL4448 datasheet by NXP Semiconductors

    • PMLL4448 - High-speed switching diodes - Cd max.: 4 pF; Configuration: single ; IF max: 200 mA; IFSM max: 4 A; IR max: 25@VR=20V nA; IFRM: 450 mA; trr max: 4 ns; VFmax: 1@IF=100mA mV; VR max: 75 V
    • Original
    • Yes
    • Yes
    • Transferred
    • EAR99
    • 8541.10.00.70
    • 8541.10.00.70
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    PMLL4448 datasheet preview

    PMLL4448 Frequently Asked Questions (FAQs)

    • NXP provides a recommended PCB layout in the application note AN11542, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
    • The input capacitor selection depends on the input voltage, output voltage, and output current requirements. A general guideline is to choose a capacitor with a voltage rating of at least 1.5 times the input voltage, and a capacitance value between 1uF to 10uF. NXP recommends using a low-ESR capacitor, such as an X5R or X7R type, to minimize voltage ripple and ensure stable operation.
    • The maximum ambient temperature for the PMLL4448 is 105°C, as specified in the datasheet. However, it's essential to consider the thermal derating curve to ensure the device operates within the recommended temperature range for reliable performance and longevity.
    • Yes, the PMLL4448 is qualified for automotive and high-reliability applications. NXP provides a dedicated automotive-grade version, PMLL4448ASA, which meets the AEC-Q100 standard for automotive reliability. Additionally, NXP offers a high-reliability version, PMLL4448HRA, which is designed for demanding industrial and aerospace applications.
    • NXP provides a troubleshooting guide in the application note AN11542, which covers common issues and their possible causes. Additionally, engineers can use tools like oscilloscopes and thermal cameras to identify and diagnose problems. It's also recommended to consult the datasheet and application notes for specific guidance on component selection, PCB layout, and thermal management.
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