A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
Use a thermally conductive material for the heat sink, ensure good airflow, and avoid overheating the device. Also, consider using a thermal interface material to improve heat transfer.
Use a common mode choke, a differential mode inductor, and a capacitor with a high self-resonant frequency to ensure effective EMI filtering.
Use a Pi-filter or an LC-filter with a high-Q inductor and a low-ESR capacitor to minimize output ripple and noise.
Ensure good airflow, use a heat sink with a high thermal conductivity, and consider using a thermal interface material to improve heat transfer.