The recommended PCB footprint for PSMN2R2-30YLC,115 is a D²PAK (TO-263) package with a minimum pad size of 6.5mm x 5.5mm and a thermal pad size of 4.5mm x 4.5mm.
To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout and thermal design guidelines.
The maximum allowed voltage transient for PSMN2R2-30YLC,115 is 40V for a duration of less than 100ms, according to the datasheet. However, it's recommended to limit voltage transients to 30V or less to ensure reliable operation.
Yes, PSMN2R2-30YLC,115 is suitable for high-frequency switching applications up to 100 kHz. However, ensure proper PCB layout, decoupling, and snubber circuit design to minimize electromagnetic interference (EMI) and ensure reliable operation.
Select a gate resistor value between 10Ω to 100Ω, depending on the specific application requirements. A higher gate resistor value can help reduce electromagnetic interference (EMI), but may increase switching times.
PSMN2R2-30YLC,115 datasheet
by NXP Semiconductors
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