A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a low-thermal-resistance path from the device to the heat sink or thermal pad.
Use a soft-start circuit to limit inrush current during start-up. For shutdown, ensure a controlled ramp-down of the output voltage to prevent voltage spikes.
Choose an output capacitor with low ESR, high ripple current rating, and a voltage rating that exceeds the maximum output voltage. Ensure the capacitor is placed close to the PT6932C to minimize parasitic inductance.
Use a type-III compensation network with a zero at the output capacitor's ESR zero frequency. Adjust the feedback resistors and capacitors to achieve a stable and fast transient response.
Ensure good airflow around the device, use a heat sink with a thermal interface material, and consider thermal vias or a thermal pad on the PCB. Keep the device junction temperature below 125°C.