The recommended PCB footprint for PTCCL05H131FBE is a rectangular pad with dimensions of 1.3 mm x 0.8 mm, with a 0.3 mm x 0.3 mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined area of 0.5 mm x 0.5 mm around the thermal pad.
The thermal pad of PTCCL05H131FBE should be connected to a copper plane on the PCB to ensure good thermal dissipation. A via or a thermal relief pattern can be used to connect the thermal pad to the copper plane. The thermal pad should not be soldered, and a non-conductive adhesive or a thermal interface material can be used to attach it to the PCB.
The maximum operating temperature range for PTCCL05H131FBE is -55°C to +150°C. However, the device should be derated above 125°C to ensure reliable operation.
To ensure the reliability of PTCCL05H131FBE in high-reliability applications, it is recommended to follow the recommended PCB layout and assembly guidelines, use a robust soldering process, and perform thorough testing and inspection. Additionally, the device should be operated within its recommended operating conditions, and any electrical overstress should be avoided.
Yes, PTCCL05H131FBE is qualified for automotive applications and meets the requirements of AEC-Q200. However, it is recommended to consult with Vishay Intertechnologies for specific requirements and qualifications for automotive applications.
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