The recommended PCB footprint for PTCTT95R100GTE is a rectangular pad with dimensions of 5.08 mm x 3.81 mm, with a thermal pad of 2.54 mm x 2.54 mm in the center.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress on the component.
The maximum power dissipation of PTCTT95R100GTE is 95 W, but this can be increased to 100 W with proper heat sinking and thermal management.
Yes, PTCTT95R100GTE can be used in high-frequency applications up to 100 kHz, but the component's impedance and parasitic inductance should be considered in the design.
The TIM of PTCTT95R100GTE is a thin layer of thermal interface material that should not be removed or damaged. Handle the component by the edges to prevent damage to the TIM.
