The recommended PCB footprint for the PTS060301B100RPU00 is a rectangular pad with dimensions of 6.1mm x 3.1mm, with a thermal pad of 2.5mm x 2.5mm in the center. The pad should have a solder mask defined (SMD) and a solder paste layer of 0.1mm to 0.2mm thickness.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder paste with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pad, and place the component on the pad. Use a reflow oven or a hot air gun to solder the component, following the recommended soldering profile.
The maximum operating temperature range for the PTS060301B100RPU00 is -55°C to 150°C. However, the device is designed to operate optimally within the temperature range of -40°C to 125°C.
Handle the PTS060301B100RPU00 with care to prevent mechanical damage. Store the components in their original packaging or in a dry, cool place. Avoid exposing the components to moisture, direct sunlight, or extreme temperatures. During shipping, use anti-static packaging materials and follow ESD handling procedures to prevent damage.
The recommended torque for the PTS060301B100RPU00's screw terminals is 0.5 Nm to 1.5 Nm. Over-tightening can damage the terminals, while under-tightening can lead to poor connections.
