NXP provides a recommended PCB layout in the application note AN11542, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
The selection of external components such as resistors, capacitors, and inductors depends on the specific application and operating conditions. NXP provides a component selection guide in the application note AN11542, which includes formulas and guidelines for selecting the correct components.
The PUMH10 is rated for operation from -40°C to 125°C, but the maximum operating temperature range may vary depending on the specific application and environmental conditions. It's recommended to consult the datasheet and application notes for specific guidance on temperature derating and thermal management.
To ensure EMC, it's recommended to follow the guidelines in the application note AN11542, which includes recommendations for PCB layout, component selection, and shielding to minimize EMI and ensure compliance with regulatory standards.
NXP recommends using a reflow soldering process with a peak temperature of 260°C for a maximum of 30 seconds. It's also recommended to follow the guidelines in the application note AN11542 for soldering and handling of the device.
PUMH10 datasheet
by NXP Semiconductors
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