The thermal resistance of the PVD1352NSPBF is typically around 2.5°C/W (junction-to-ambient) and 1.5°C/W (junction-to-case). However, this value can vary depending on the specific application and cooling conditions.
Yes, the PVD1352NSPBF is designed for high-reliability applications and is qualified to automotive and industrial standards. It has a high MTBF (mean time between failures) and is suitable for use in harsh environments.
To ensure proper soldering, follow the recommended soldering profile and use a solder with a melting point above 217°C. Also, make sure the PCB is clean and free of oxidation, and use a soldering iron with a temperature control to prevent overheating.
The maximum operating temperature of the PVD1352NSPBF is 150°C (junction temperature). However, it's recommended to operate the device at a temperature below 125°C to ensure reliable operation and to prevent thermal runaway.
Yes, the PVD1352NSPBF can be used in a parallel configuration to increase the current handling capability. However, it's essential to ensure that the devices are properly matched and that the current sharing is balanced to prevent overheating and reduce reliability.
