ROHM provides a recommended PCB layout in their application note (AN191) for thermal management. It suggests using a thermal pad, thermal vias, and a heat sink to improve heat dissipation.
To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a heat sink, and consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
The maximum allowable power dissipation for the RB068L-40DDTE25 is 2W. However, it's essential to consider the thermal resistance, ambient temperature, and heat sink design to ensure the device operates within its recommended temperature range.
Yes, the RB068L-40DDTE25 is suitable for switching regulator applications due to its low RDS(on) and high-speed switching capabilities. However, ensure that the device is properly driven and the switching frequency is within the recommended range.
ROHM recommends using a dedicated driver IC or a logic-level driver with a suitable drive strength to ensure proper switching and minimize power losses. The recommended drive circuit is shown in the datasheet and application notes.
RB068L-40DDTE25 datasheet
by ROHM Semiconductor
