RB068L150DDTE25 datasheet by ROHM Semiconductor

RB068L150DDTE25 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance of RB068L150DDTE25?
  ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
• How do I ensure the reliability of RB068L150DDTE25 in high-temperature applications?
  To ensure reliability, follow the recommended derating curves for temperature and voltage, and consider using a heat sink or thermal interface material. Also, ensure proper PCB design, assembly, and soldering to prevent thermal stress.
• What is the maximum allowed voltage for RB068L150DDTE25, considering voltage spikes and transients?
  While the datasheet specifies a maximum voltage rating of 25V, it's recommended to consider a 10-15% margin for voltage spikes and transients. Therefore, the maximum allowed voltage should be around 22-23V to ensure safe operation.
• How do I handle ESD protection for RB068L150DDTE25 during handling and assembly?
  Follow standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation. Ensure that all equipment and tools are properly grounded, and consider using ESD-protective packaging and storage materials.
• What is the recommended storage condition for RB068L150DDTE25 to prevent moisture-related issues?
  Store RB068L150DDTE25 in a dry, cool place with a relative humidity below 60%. Avoid storing the devices in direct sunlight or near heat sources. If the devices are stored for an extended period, consider using a dry pack or desiccant to maintain low humidity.