The recommended land pattern for RC1005F1023CS is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink. The thermal resistance (Rth) of the chip is 35°C/W, and the maximum operating temperature is 125°C. Keep the ambient temperature below 85°C to ensure reliable operation.
The recommended soldering profile for RC1005F1023CS is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 4°C/s or less.
To ensure reliability in high-vibration environments, use a robust mounting method, such as underfill or potting, to secure the component. Additionally, consider using a vibration-resistant capacitor with a high mechanical stress tolerance.
The equivalent series resistance (ESR) of RC1005F1023CS is 0.1 ohms maximum at 100 kHz and 20°C.
