REF3325AIDBZTG4 datasheet by Texas Instruments

REF3325AIDBZTG4 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the REF3325AIDBZTG4 to ensure optimal performance?
  A good PCB layout for the REF3325AIDBZTG4 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
• How do I ensure the REF3325AIDBZTG4 is properly decoupled?
  To ensure proper decoupling, place a 10uF ceramic capacitor between the VIN pin and the GND pin, and a 100nF ceramic capacitor between the VOUT pin and the GND pin. Additionally, use a 1uF ceramic capacitor between the VIN pin and the VOUT pin.
• What is the maximum output current that the REF3325AIDBZTG4 can provide?
  The REF3325AIDBZTG4 can provide a maximum output current of 50mA. However, it's recommended to limit the output current to 30mA to ensure optimal performance and stability.
• How do I adjust the output voltage of the REF3325AIDBZTG4?
  The output voltage of the REF3325AIDBZTG4 can be adjusted by using a resistive divider network between the VOUT pin and the ADJ pin. The output voltage can be calculated using the formula: VOUT = 2.5V x (1 + R1/R2), where R1 and R2 are the resistors in the divider network.
• What is the thermal derating of the REF3325AIDBZTG4?
  The REF3325AIDBZTG4 has a thermal derating of 6.4mW/°C above 25°C. This means that the device's power dissipation should be reduced by 6.4mW for every degree Celsius above 25°C to prevent overheating.