A good thermal design should include a solid ground plane, thermal vias under the device, and a heat sink if necessary. Refer to the TI application note 'Thermal Design By Example' for more information.
Choose an output capacitor with low ESR (Equivalent Series Resistance) and high capacitance. A 10uF to 22uF ceramic capacitor with X5R or X7R dielectric is recommended. Refer to the datasheet for more information on output capacitor selection.
A 1uF to 10uF ceramic capacitor with X5R or X7R dielectric is recommended for input decoupling. The capacitor should be placed as close to the VIN pin as possible.
Ensure the output capacitor is properly selected, and the input capacitor is placed close to the VIN pin. Also, minimize the distance between the device and the output capacitor. Refer to the datasheet for more information on stability and oscillation prevention.
The maximum ambient temperature for the REG71050DRVR is 85°C. However, the device can operate up to 125°C junction temperature. Refer to the datasheet for more information on thermal specifications.