RFB-1117-BT datasheet by RF Industries

RFB-1117-BT Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance of the RFB-1117-BT?
  RF Industries recommends a 4-layer PCB with a solid ground plane, and a microstrip transmission line design to minimize signal loss and ensure impedance matching.
• How do I ensure proper thermal management for the RFB-1117-BT?
  RF Industries suggests using a heat sink with a thermal conductivity of at least 1 W/m-K, and applying a thermal interface material with a thermal conductivity of at least 5 W/m-K between the device and the heat sink.
• What is the maximum operating temperature range for the RFB-1117-BT?
  The RFB-1117-BT is rated for operation from -40°C to +85°C, but RF Industries recommends derating the power handling above +70°C to ensure reliability and prevent thermal runaway.
• Can I use the RFB-1117-BT in a humid or high-moisture environment?
  RF Industries recommends conformal coating the device to protect it from moisture, and ensuring the operating environment is within the recommended relative humidity range of 5% to 95% non-condensing.
• What is the recommended soldering profile for the RFB-1117-BT?
  RF Industries suggests using a soldering profile with a peak temperature of 240°C, a dwell time of 30-60 seconds, and a cooling rate of 3-5°C per second to prevent thermal shock and ensure reliable connections.