A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use a 50-ohm impedance-controlled line to minimize signal reflections.
Ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Also, follow the recommended thermal design guidelines in the datasheet.
Power up the device in the following sequence: VCC, then VDD, and finally the enable pin (EN). This ensures proper initialization and prevents damage to the device.
Use a spectrum analyzer to measure the output power and frequency. Check the PCB layout for any signal integrity issues, and verify that the device is properly biased and configured.
Yes, but you'll need to use an impedance-matching network to ensure maximum power transfer. Consult the datasheet for guidance on impedance matching and use a network analyzer to optimize the matching circuit.