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Mini-Circuits recommends a 4-layer PCB with a solid ground plane, and a via-stitched ground plane around the device. The device should be placed near the edge of the board to minimize the distance to the connector. A low-impedance path to ground is essential for optimal performance.
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To achieve the specified return loss and VSWR performance, ensure that the device is properly matched to the system impedance (typically 50 ohms). Use a high-quality PCB material with a low dielectric loss tangent, and maintain a consistent impedance throughout the signal path. Additionally, use a suitable connector and cable assembly to minimize reflections and losses.
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The RMS-1LH is rated for a maximum input power of +20 dBm (100 mW). Exceeding this power level may cause damage to the device or affect its performance. It's essential to ensure that the input power is within the specified range to maintain the device's reliability and performance.
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To troubleshoot common issues, start by verifying the PCB layout and grounding scheme. Check for any soldering or assembly errors, and ensure that the device is properly matched to the system impedance. Use a vector network analyzer (VNA) to measure the device's S-parameters and identify any anomalies. Consult the Mini-Circuits application notes and technical support resources for further guidance.
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The RMS-1LH has a maximum operating temperature of +85°C. To ensure reliable operation, maintain a reasonable thermal gradient around the device. Use a heat sink or thermal pad if necessary, and ensure good airflow around the device. Avoid exposing the device to extreme temperatures or thermal shocks.
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