Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design guidelines, such as providing adequate heat sinking, using a thermal interface material, and keeping the device within its recommended operating temperature range (−40°C to 125°C).
Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the device.
Toshiba recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input pins to protect the RN2426 from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
Toshiba recommends a soldering temperature of 260°C (peak temperature) and a soldering time of 10 seconds or less to prevent damage to the device. It's also essential to follow the recommended soldering profile and use a solder with a melting point above 217°C.
RN2426(TE85L,F) datasheet
by Toshiba America Electronic Components
