The recommended PCB footprint for the RS401GL-BP is a rectangular pad with dimensions of 1.5mm x 0.8mm, with a 0.5mm diameter hole in the center for the pin. The pad should be solder-mask defined and have a non-solder-mask-defined area of 0.2mm around the pin.
The RS401GL-BP has a thermal resistance of 10°C/W. To ensure reliable operation, it's recommended to provide a thermal pad on the PCB with a minimum size of 2mm x 2mm, and to use a thermal interface material with a thermal conductivity of at least 1 W/m-K.
The maximum allowed voltage for the RS401GL-BP is 40V. Exceeding this voltage may cause damage to the device or affect its reliability.
To ensure reliability in high-temperature applications, it's recommended to derate the voltage and current ratings of the RS401GL-BP according to the temperature derating curve provided in the datasheet. Additionally, ensure that the device is operated within the recommended operating temperature range of -40°C to 125°C.
The recommended storage condition for the RS401GL-BP is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid exposing the devices to direct sunlight, moisture, or extreme temperatures.
RS401GL-BP datasheet
by Micro Commercial Components
