ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Use a soldering iron with a temperature of 350°C (662°F) or less, and apply a soldering flux to the thermal pad. Ensure the component is aligned properly and soldered within 3 seconds to prevent thermal damage.
The maximum allowed voltage for the RSB12WMTL is 12V, but it's recommended to operate within the specified voltage range of 7V to 10V for optimal performance and reliability.
The RSB12WMTL is rated for operation up to 150°C (302°F), but derating is required for temperatures above 125°C (257°F). Consult the datasheet for specific derating guidelines.
Use the formula: Pd = (Vin - Vout) x Iout, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Ensure the calculated Pd is within the specified maximum power dissipation rating.
