ABLIC recommends a thermal layout with a thermal pad connected to a large copper area on the PCB, and a minimum of 2oz copper thickness. A thermal via array under the IC can improve heat dissipation.
To ensure stability with a low-ESR output capacitor, add a 1-10nF ceramic capacitor in parallel with the output capacitor to improve phase margin. Additionally, ensure the output capacitor's ESR is within the recommended range (10mΩ to 100mΩ).
The maximum allowed voltage on the EN (enable) pin is 6V. Exceeding this voltage may cause damage to the internal circuitry.
The S-1721A1218-I6T1U is rated for operation up to 125°C. However, the output voltage accuracy and other specifications may degrade at high temperatures. Ensure the device is within its recommended operating conditions for reliable operation.
Calculate the power dissipation (PD) using the formula: PD = (VIN - VOUT) x IOUT + (VIN x IQ), where IQ is the quiescent current. Ensure the calculated PD is within the recommended maximum power dissipation (500mW) to prevent overheating.