ABLIC recommends a thermal pad size of at least 2.5mm x 2.5mm with multiple vias to the ground plane to ensure efficient heat dissipation. Additionally, keeping the PCB layer stack-up symmetrical and using a solid ground plane can help reduce thermal resistance.
To ensure the device operates within the specified temperature range, it's essential to provide adequate heat sinking, such as a thermal pad or heat sink, and to keep the ambient temperature within the recommended range. Additionally, avoiding high-power dissipation and reducing the duty cycle can help minimize temperature rise.
ABLIC recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for at least 10V, as close to the VIN pin as possible. This helps to filter out noise and ensure stable operation.
The POR and BOR functions are designed to reset the device during power-up or brown-out conditions. To handle these functions, ensure that the power supply is stable and within the recommended range, and that the reset pin is properly connected to a pull-up resistor and capacitor to filter out noise.
To minimize voltage drops and ensure reliable operation, ABLIC recommends using wide, low-impedance traces for the high-current output pins, keeping them as short as possible and avoiding sharp corners or bends. Additionally, using multiple vias to the power plane can help reduce inductance and improve current handling.
S-8254ABEFT-TB-U datasheet
by ABLIC Inc.
