The recommended PCB footprint for the S1MB-13-F is a standard SOT23 package with a 1.3mm x 1.3mm body size and a 0.5mm pitch. A minimum pad size of 0.6mm x 0.6mm is recommended for reliable soldering.
To ensure reliable operation in high-temperature environments, it is recommended to derate the maximum junction temperature (Tj) by 1°C for every 1W of power dissipation above 25°C. Additionally, ensure good thermal design and heat sinking to minimize thermal resistance.
The maximum safe operating area (SOA) for the S1MB-13-F is defined by the maximum voltage (Vds) and current (Ids) ratings. The device can operate safely within the boundaries of Vds ≤ 20V and Ids ≤ 1A. Exceeding these ratings may result in reduced reliability or device failure.
To prevent electrostatic discharge (ESD) damage, handle the S1MB-13-F with ESD-protective equipment and follow proper ESD handling procedures. The device has an internal ESD protection diode, but external ESD protection measures are still recommended to prevent damage during handling and assembly.
Store the S1MB-13-F in a dry, cool place (≤ 30°C and ≤ 60% RH) away from direct sunlight and moisture. Avoid exposing the device to mechanical stress, vibration, or extreme temperatures during storage and handling.
S1MB-13-F datasheet
by Diodes Incorporated
