Diodes Incorporated recommends a PCB layout with a solid ground plane and a thermal relief pattern under the device to ensure optimal thermal performance. A minimum of 2oz copper thickness is recommended for the PCB.
To ensure proper soldering, Diodes Incorporated recommends using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. The device should be soldered to a PCB with a solder mask to prevent solder bridging.
The SBL30L30CT is designed to withstand a maximum voltage stress of 30V. Exceeding this voltage may cause permanent damage to the device.
Diodes Incorporated recommends handling the SBL30L30CT with ESD precautions, such as using an ESD wrist strap or mat, and storing the device in an ESD-protected package. The device has an internal ESD protection diode, but external ESD protection measures are still recommended.
The SBL30L30CT is designed to operate within a temperature range of -40°C to 150°C. Operating the device outside of this range may affect its performance and reliability.
SBL30L30CT datasheet
by Diodes Incorporated
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