The recommended PCB footprint for the SBLB25L30CT-E3/81 is a rectangular pad with dimensions of 5.5mm x 2.5mm, with a thermal pad of 2.5mm x 2.5mm in the center. The pad should have a solder mask defined (SMD) and a solder paste layer.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and a solder paste with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pad, and place the component on the pad. Use a reflow oven or a soldering iron to melt the solder paste, and ensure that the component is properly aligned and seated.
The maximum operating temperature range for the SBLB25L30CT-E3/81 is -55°C to 150°C. However, the device is designed to operate optimally within the temperature range of -40°C to 125°C.
Yes, the SBLB25L30CT-E3/81 is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB. Additionally, consider using a vibration-dampening material or a mechanical fastening system to further reduce the risk of component detachment.
To prevent ESD damage, handle the SBLB25L30CT-E3/81 in an ESD-protected environment, wear an ESD wrist strap or use ESD-safe tools, and avoid touching the component's pins or leads. If you need to store the component, use an ESD-safe packaging material or a conductive bag.
SBLB25L30CT-E3/81 datasheet
by Vishay Semiconductors
Findchips
