A good PCB layout for the SBM1040-13 should minimize parasitic inductance and capacitance. Place the device close to the power source, use short and wide traces, and avoid vias under the device. A 4-layer PCB with a solid ground plane is recommended.
The SBM1040-13 has a thermal pad on the bottom. Ensure good thermal contact with the PCB by applying a thermal interface material (TIM) and using a heat sink or a metal core PCB. Keep the surrounding components at a safe distance to allow for airflow.
Although the datasheet doesn't specify a maximum voltage for the EN pin, it's recommended to keep it within the VCC range (typically 5V or 3.3V) to ensure proper operation and prevent damage.
The SBM1040-13 has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at higher temperatures. Consider derating the device or using a heat sink to maintain a safe operating temperature.
Check the input voltage, output current, and temperature. Verify the PCB layout and thermal design. Use an oscilloscope to monitor the input and output waveforms. Consult the datasheet and application notes for guidance on troubleshooting and fault detection.
