The recommended land pattern for SBR1045D1-13 is a rectangular pad with a size of 1.3mm x 0.8mm, with a 0.5mm diameter thermal pad in the center. The pad should be solder-mask defined (SMD) with a non-solder-mask-defined (NSMD) thermal pad.
The thermal pad of SBR1045D1-13 should be connected to a copper plane on the PCB to ensure good thermal dissipation. A thermal via array or a solid copper fill can be used to connect the thermal pad to the copper plane.
The maximum operating temperature range for SBR1045D1-13 is -55°C to 150°C. However, the device is typically specified for operation from -40°C to 125°C.
Yes, SBR1045D1-13 is suitable for high-reliability applications. It is manufactured using a high-reliability process and is qualified to automotive and industrial standards.
To ensure the reliability of SBR1045D1-13 in a high-temperature environment, it is recommended to follow proper PCB design and assembly guidelines, including thermal management, and to operate the device within its specified temperature range.
SBR1045D1-13 datasheet
by Diodes Incorporated
