The recommended PCB footprint for the SBR1A400P1-7 is a standard SOD-123 package footprint with a pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
To ensure reliability in high-temperature applications, ensure that the device is operated within its recommended operating temperature range of -55°C to 150°C, and follow proper thermal management practices such as using a heat sink or thermal interface material.
The maximum allowable voltage stress on the SBR1A400P1-7 is 400V, as specified in the datasheet. Exceeding this voltage may cause damage to the device.
Yes, the SBR1A400P1-7 can be used in high-frequency applications up to 1MHz. However, the device's performance may degrade at higher frequencies, and additional considerations such as parasitic inductance and capacitance should be taken into account.
To prevent electrostatic discharge (ESD) damage, handle the SBR1A400P1-7 with ESD-protective equipment such as wrist straps, mats, and bags. Ensure that the device is stored in a static-protective package when not in use.
SBR1A400P1-7 datasheet
by Diodes Incorporated
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