The recommended PCB footprint and land pattern for the SBR20U100CTE-G can be found in the Diodes Incorporated application note AN154, which provides detailed guidelines for PCB layout and assembly.
To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal interface material to reduce the junction temperature of the device.
The maximum allowable voltage stress on the SBR20U100CTE-G during switching is dependent on the specific application and operating conditions. As a general guideline, it is recommended to limit the voltage stress to 1.5 times the rated voltage to ensure reliable operation.
Yes, the SBR20U100CTE-G can be used in parallel to increase current handling capability, but it is essential to ensure that the devices are properly matched and that the current sharing is balanced to avoid overheating and reliability issues.
The recommended storage and handling procedure for the SBR20U100CTE-G is to store the devices in their original packaging, away from direct sunlight and moisture, and to handle them with anti-static precautions to prevent electrostatic discharge damage.
SBR20U100CTE-G datasheet
by Diodes Incorporated
