SBR20U60CT-G datasheet by Diodes Incorporated

SBR20U60CT-G Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBR20U60CT-G?
  The recommended PCB footprint for the SBR20U60CT-G is a standard SOD-123 package with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm, with a 0.5mm spacing between pads.
• How do I ensure reliable soldering of the SBR20U60CT-G?
  To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste or flux to the pads. Avoid applying excessive heat or pressure, which can damage the device.
• What is the maximum operating temperature range for the SBR20U60CT-G?
  The maximum operating temperature range for the SBR20U60CT-G is -55°C to 150°C, with a maximum junction temperature of 150°C.
• Can I use the SBR20U60CT-G in a high-frequency switching application?
  Yes, the SBR20U60CT-G is suitable for high-frequency switching applications up to 100 kHz, but it's essential to consider the device's switching losses, thermal management, and PCB layout to ensure reliable operation.
• How do I protect the SBR20U60CT-G from electrostatic discharge (ESD)?
  To protect the SBR20U60CT-G from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB and components are properly grounded. Avoid touching the device's pins or exposing it to high-voltage sources.