SBR3U20SA-13 datasheet by Diodes Incorporated

SBR3U20SA-13 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBR3U20SA-13?
  The recommended PCB footprint for the SBR3U20SA-13 is a standard SOD-123 package footprint with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
• How do I ensure the SBR3U20SA-13 is properly soldered to the PCB?
  To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
• What is the maximum operating temperature range for the SBR3U20SA-13?
  The maximum operating temperature range for the SBR3U20SA-13 is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
• Can I use the SBR3U20SA-13 in a high-reliability application?
  Yes, the SBR3U20SA-13 is suitable for high-reliability applications due to its robust design and manufacturing process. However, it's essential to follow proper design and assembly guidelines to ensure the component's reliability.
• How do I handle ESD protection when working with the SBR3U20SA-13?
  To prevent ESD damage, handle the SBR3U20SA-13 with an ESD wrist strap or mat, and ensure the PCB and assembly process follow ESD-safe practices.