SBR8U60P5-13 datasheet by Diodes Incorporated

SBR8U60P5-13 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SBR8U60P5-13?
  The recommended PCB footprint for the SBR8U60P5-13 is a standard SOD-123 package with a 1.7mm x 1.3mm body size. A minimum pad size of 1.1mm x 0.8mm is recommended for reliable soldering.
• How do I ensure reliable operation of the SBR8U60P5-13 in high-temperature environments?
  To ensure reliable operation in high-temperature environments, it is recommended to derate the maximum junction temperature (Tj) by 1°C for every 1W of power dissipation above 25°C. Additionally, ensure good thermal conductivity between the device and the PCB, and consider using a heat sink if necessary.
• What is the maximum allowable voltage stress on the SBR8U60P5-13?
  The maximum allowable voltage stress on the SBR8U60P5-13 is 60V, as specified in the datasheet. Exceeding this voltage may cause permanent damage to the device.
• Can I use the SBR8U60P5-13 in a switching regulator application?
  Yes, the SBR8U60P5-13 can be used in switching regulator applications due to its fast switching speed and low reverse recovery time. However, ensure that the device is properly snubbed to prevent voltage spikes and ringing.
• How do I handle ESD protection when handling the SBR8U60P5-13?
  To prevent electrostatic discharge (ESD) damage, handle the SBR8U60P5-13 with an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. Avoid touching the device pins or handling the device in close proximity to ESD-sensitive areas.