A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks short and symmetrical, and use a common mode choke to reduce EMI.
Use a thermal pad or a heat sink to keep the junction temperature below 125°C. Ensure good airflow and avoid thermal hotspots. Also, consider using a temperature sensor to monitor the device temperature.
Typical values are not guaranteed and may vary from device to device. They are provided as a guideline for design and should not be used as a specification. Always use the minimum and maximum values for design calculations.
Yes, the SCC2692AC1N28 is suitable for switching power supplies. However, ensure that the device is properly bypassed and decoupled to minimize noise and ripple. Also, consider the device's power dissipation and thermal management.
Start by checking the power supply voltage, input and output waveforms, and device temperature. Use an oscilloscope to measure the output voltage and current. Check for proper PCB layout, decoupling, and thermal management. Consult the datasheet and application notes for guidance.
