NXP provides a recommended PCB layout in the application note AN11529, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
NXP provides a component selection guide in the datasheet, which includes recommendations for external components such as resistors, capacitors, and inductors. Additionally, the application note AN11529 provides more detailed guidance on component selection and optimization.
The SCC2692AE1N28,602 has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinking, thermal vias, and airflow management. NXP provides thermal management guidelines in the application note AN11529.
NXP provides a troubleshooting guide in the application note AN11529, which covers common issues such as startup problems, oscillation, and output voltage regulation. Additionally, NXP's support team and online forums can provide further assistance.
The SCC2692AE1N28,602 is designed to meet EMI and EMC standards, but proper PCB layout, component selection, and shielding are still essential to minimize electromagnetic interference. NXP provides EMI and EMC guidelines in the application note AN11529 and the datasheet.
SCC2692AE1N28,602 datasheet
by NXP Semiconductors
