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    SCN2661BC1A28 datasheet by Philips Semiconductors

    • Enhanced programmable communications interface EPCI
    • Original
    • No
    • Transferred
    • 8542.31.00.01
    • 8542.31.00.00
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    SCN2661BC1A28 datasheet preview

    SCN2661BC1A28 Frequently Asked Questions (FAQs)

    • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for airflow.
    • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a heat sink or thermal pad, and implement thermal management techniques such as reducing power consumption or using a fan.
    • Operating the device beyond the recommended voltage range can lead to reduced reliability, increased power consumption, and potentially even damage to the device. It's essential to follow the recommended voltage range to ensure optimal performance and longevity.
    • To troubleshoot issues related to the device's internal oscillator, check the oscillator circuitry, ensure proper power supply decoupling, and verify that the oscillator pins are not loaded or short-circuited. If issues persist, consult the datasheet or contact Philips Semiconductors support.
    • To prevent electrostatic discharge (ESD) damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and follow proper handling and storage procedures. Ensure that your workstation and tools are ESD-compliant.
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