ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. ROHM also recommends derating the device's power dissipation according to the ambient temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a no-clean flux, and the soldering iron should be set to a temperature of 350°C (662°F) to 370°C (698°F).
To prevent ESD damage, handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. During assembly, use ESD-protected packaging and follow proper handling procedures.
Store the device in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 125°C (-40°F to 257°F), and the relative humidity should be below 60%. Avoid exposing the device to mechanical stress, vibration, or shock.
