ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat dissipation measures are in place.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/s. Refer to the ROHM soldering guidelines for more information.
The SCS230KE2GC11 is not designed for use in high-humidity environments. If operation in high humidity is required, consider using a moisture-resistant coating or conformal coating to protect the device.
ROHM recommends storing the SCS230KE2GC11 in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the device in direct sunlight or near heat sources.
