A recommended PCB layout for optimal thermal performance would be to have a solid copper plane on the bottom layer of the PCB, connected to the thermal pad of the SD860-T. This helps to dissipate heat efficiently. Additionally, it's recommended to have a minimum of 2oz copper thickness and to avoid having any thermal vias or holes under the device.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and to avoid any thermal hotspots on the PCB.
Although the datasheet specifies the recommended operating voltage range, it's essential to note that the maximum allowed voltage on the input pins is 6V. Exceeding this voltage may cause damage to the device or affect its reliability.
To handle ESD protection for the SD860-T, it's recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, consider adding ESD protection devices, such as TVS diodes, on the input lines to protect the SD860-T from electrostatic discharge.
The recommended soldering profile for the SD860-T is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow the recommended soldering profile to avoid damaging the device or affecting its reliability.
SD860-T datasheet
by Diodes Incorporated
