A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities.
The SDM40E20LC-7 has built-in ESD protection, but handling precautions are still necessary. Use an anti-static wrist strap, work on an ESD-safe surface, and avoid touching the device's pins or leads.
The SDM40E20LC-7 is a commercial-grade device, but it can be used in high-reliability or automotive applications with proper design, testing, and validation. Consult with Diodes Incorporated for specific guidance.
Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and time above 183°C 90s. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force.
SDM40E20LC-7 datasheet
by Diodes Incorporated
