SDS850R-222N datasheet by API Delevan

SDS850R-222N Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance?
  API Delevan recommends a 4-layer PCB with a solid ground plane, and a microstrip or stripline configuration for the signal lines. A minimum of 20 mils of clearance around the component is also recommended.
• How do I handle the thermal management of the SDS850R-222N?
  The SDS850R-222N has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the component and consider using a heat sink if necessary.
• What is the maximum operating temperature range for the SDS850R-222N?
  The SDS850R-222N is rated for operation from -40°C to +85°C. However, derating may be necessary for high-power applications or extreme environmental conditions.
• Can I use the SDS850R-222N in a high-reliability or aerospace application?
  The SDS850R-222N is a commercial-grade component, but API Delevan offers a high-reliability version, the SDS850R-222N-HR, which meets the requirements of MIL-PRF-83401. Contact API Delevan for more information on the high-reliability version.
• How do I troubleshoot issues with the SDS850R-222N?
  API Delevan recommends following a structured troubleshooting approach, including visual inspection, signal integrity analysis, and power supply verification. Consult the API Delevan application note AN-SDS850R-222N for detailed troubleshooting guidelines.