The recommended PCB footprint for the SI1302DL-T1-GE3 is a 2x2 array of 0.5mm x 0.5mm pads with a 1.27mm pitch. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C. Apply a small amount of solder paste to the PCB pads, and then place the SI1302DL-T1-GE3 on the pads. Use a reflow oven or a hot air gun to melt the solder paste, and ensure the component is properly aligned during the soldering process.
The maximum operating temperature range for the SI1302DL-T1-GE3 is -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
To prevent damage, store the SI1302DL-T1-GE3 in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, extreme temperatures, or physical stress during shipping and storage.
The SI1302DL-T1-GE3 is an ESD-sensitive device and requires proper handling and storage to prevent damage. Use ESD-protected workstations, wrist straps, and packaging materials to prevent electrostatic discharge.
SI1302DL-T1-GE3 datasheet
by Vishay Siliconix
