The recommended PCB footprint for the SI1424EDH-T1-GE3 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.7V to 5.5V. The enable pin (EN) should be tied to a logic high (VCC) to enable the device. The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to ensure stability.
The SI1424EDH-T1-GE3 is rated for operation in an ambient temperature range of -40°C to +125°C. However, the device's performance and reliability may degrade if operated at extreme temperatures for extended periods.
Yes, the SI1424EDH-T1-GE3 is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions and design guidelines to ensure the device meets the required reliability and performance standards.
To prevent electrostatic discharge (ESD) damage, handle the SI1424EDH-T1-GE3 with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or handling it in environments with high electrostatic potential.
SI1424EDH-T1-GE3 datasheet
by Vishay Siliconix
