SI1563EDH-T1-E3 datasheet by Vishay Siliconix

SI1563EDH-T1-E3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI1563EDH-T1-E3?
  The recommended PCB footprint for the SI1563EDH-T1-E3 is a 3x3mm QFN package with a 0.5mm pitch. A minimum of 2mm clearance around the device is recommended for thermal and electrical considerations.
• How do I ensure the device operates within the specified junction temperature range?
  To ensure the device operates within the specified junction temperature range, provide adequate heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Additionally, consider using a thermal management system, such as a heat sink or fan, depending on the application's power dissipation requirements.
• What is the maximum allowed voltage on the enable pin (EN)?
  The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may cause damage to the device. Ensure the voltage on the EN pin does not exceed the recommended maximum voltage to prevent device damage or malfunction.
• Can I use the SI1563EDH-T1-E3 in a high-reliability or automotive application?
  Yes, the SI1563EDH-T1-E3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 qualification standard and is suitable for use in harsh environments. However, ensure you follow the recommended design and testing guidelines for your specific application.
• How do I handle the device's power sequencing requirements?
  The SI1563EDH-T1-E3 requires proper power sequencing to prevent damage or malfunction. Ensure the input voltage (VIN) is applied before the enable pin (EN) is asserted. Additionally, ensure the output voltage (VOUT) is stable before connecting any loads.