SI1865DL-T1-E3 datasheet by Vishay Siliconix

SI1865DL-T1-E3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI1865DL-T1-E3?
  The recommended PCB footprint for the SI1865DL-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 0.8mm x 0.8mm and a thermal pad size of 2.5mm x 2.5mm.
• How do I ensure the SI1865DL-T1-E3 is properly biased for optimal performance?
  To ensure proper biasing, connect the input pin (VIN) to a stable voltage source, and the enable pin (EN) to a logic-level signal. The output pin (VOUT) should be decoupled with a 10uF ceramic capacitor.
• What is the maximum ambient temperature range for the SI1865DL-T1-E3?
  The SI1865DL-T1-E3 is rated for operation in ambient temperatures ranging from -40°C to 125°C.
• Can I use the SI1865DL-T1-E3 in a high-reliability application?
  Yes, the SI1865DL-T1-E3 is qualified to AEC-Q100 Grade 1, making it suitable for high-reliability applications such as automotive systems.
• How do I handle ESD protection when handling the SI1865DL-T1-E3?
  To prevent ESD damage, handle the SI1865DL-T1-E3 with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device pins or handling the device in environments with high electrostatic potential.