The recommended PCB footprint for the SI2305DS-T1-E3 is a 2x2 array of 0.5mm diameter pads with a 1.27mm pitch. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C. Apply a small amount of solder paste to the PCB pads, and then place the SI2305DS-T1-E3 on the pads. Use a reflow oven or a hot air gun to solder the device. Avoid overheating or using excessive force, which can damage the device.
The SI2305DS-T1-E3 has an operating temperature range of -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range. It's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance.
The SI2305DS-T1-E3 is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use the device in a humid environment, ensure the PCB is properly coated with a moisture-resistant material, and follow proper handling and storage procedures to minimize moisture exposure.
Handle the SI2305DS-T1-E3 by the body, avoiding touching the leads or electrical contacts. Store the device in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
SI2305DS-T1-E3 datasheet
by Vishay Siliconix
