The recommended PCB footprint for the SI2343DS-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the device.
The maximum operating temperature range for the SI2343DS-T1-E3 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
Yes, the SI2343DS-T1-E3 is suitable for high-reliability applications, such as automotive, industrial, and aerospace, due to its high-quality manufacturing process and rigorous testing procedures.
To prevent electrostatic discharge (ESD) damage, handle the SI2343DS-T1-E3 with an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.
SI2343DS-T1-E3 datasheet
by Vishay Siliconix
