The recommended PCB footprint for the SI3407DV-T1-GE3 is a standard QFN16 package with a 3x3mm body size and 0.5mm pitch. A recommended land pattern is available in the Vishay Intertechnologies application note AN81142.
To ensure proper soldering, follow the recommended soldering profile and guidelines outlined in the Vishay Intertechnologies application note AN81142. Additionally, use a solder paste with a melting point between 217°C to 220°C and a peak temperature of 240°C to 250°C.
The SI3407DV-T1-GE3 has an operating temperature range of -40°C to 125°C. However, the device can be operated up to 150°C for short-term excursions, but this may affect its reliability and lifespan.
To prevent electrostatic discharge (ESD) damage, handle the SI3407DV-T1-GE3 in an ESD-protected environment, wear an ESD strap or wrist strap, and use ESD-safe packaging and materials. Follow the guidelines outlined in the ANSI/ESD S20.20 standard.
Store the SI3407DV-T1-GE3 in its original packaging or in a dry, cool place with a relative humidity of 50% or less. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
SI3407DV-T1-GE3 datasheet
by Vishay Siliconix
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