The recommended PCB footprint for the SI3410DV-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure proper biasing, connect the VIN pin to a stable voltage source between 2.5 V and 5.5 V, and the VOUT pin to a load impedance of at least 1 kΩ. Also, ensure the EN pin is tied to a logic high (VIN) to enable the device.
The SI3410DV-T1-GE3 has an operating temperature range of -40°C to 125°C, making it suitable for a wide range of industrial and automotive applications.
The output voltage of the SI3410DV-T1-GE3 can be calculated using the formula: VOUT = (R1 / R2) * (VIN - VREF), where R1 and R2 are the resistors connected to the FB pin, VIN is the input voltage, and VREF is the internal reference voltage (1.25 V).
The maximum input voltage that can be applied to the SI3410DV-T1-GE3 is 6.5 V, exceeding which may cause damage to the device.